ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and ...

With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has intensified, driving ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Thermal compression bonding (TCB) addresses these challenges by using a localized bond head to apply precise heat (150–300°C) and pressure (10–200 MPa) to individual bumps. This process enables micron ...

Copper-copper bonding is emerging as a pivotal technology in three-dimensional integration, offering a viable pathway towards overcoming the limitations of traditional interconnect methods. By ...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech aims to ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

ASMPT wins repeat orders for 15 C2S TCB tools from a major OSAT partner, positioning to capture significant share of a ...